Design of temperature cycling detection system based on MCGS and digital temperature sensor
基于MCGS数字温度传感器的温度巡检系统设计
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Interface void damage is the failure characteristic of solder joint under temperature cycling.
温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度.
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Result show that IMC layer increased with the cycles, and it grew faster temperature cycling.
结果表明,随着循环周期的增加,界面IMC层 的厚度增加, 且低温极限温度越低时IMC生长 越快.
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C-UV9911可用于IC芯片的球形封装并具有极佳的温度循环性能.
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通过扫描电镜（SEM）对温度循环试验后焊球金属间化合物（IMC）层和剪切强度试验后的断裂面进行了形貌、结构和组分的观察及分析。
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Test methods for environmental properties of optical fibres& Temperature cycling
GB/T8404.2-1987光纤的环境性能试验方法温度循环
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The cycling Build-up removal air system make the material prewarming and keeping temperature.
采用内建式抽风系统循环应用,让受热体有预温,保温功用.
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Effect of temperature cycling stress profile on the thermal fatigue life of solder joints of QFP
温度循环应力剖面对QFP焊点热疲劳寿命的影响
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